Application Development Solution of Flexible PCB

-Wuhan Senter Industry & Trade Co Ltd will offer you with world-class product solution service, including product exploitation, design, specimen supply and large quantities of supply.

-Topping technology and abundant experience of engineering design

-Create more added value to clients products" service logos

-Integral and reliable product solution

-Multiyear mould exploitation experience guarantees high precision of mould manufacture

-High efficient manufacture of precision equipment with topping quality

-Manufacture of Flexible Circuit and Component Assembly

Double-sided Board

Process: Electrolyte Ni/Au;

Finished Board Thickness: 0.4mm;

Line Width/Line Space: 3mil/3mil

04 layers Board

Process: Gold Finger & HAL;

Finished Board Thickness: 1.6mm;

Line Width/Line Space: 5mil/4mil

06 layers Board

Process: Immersion Ni/Au + Solder;

Finished Board Thickness: 1.6mm;

08 layers

Process: Electrolyte Ni/Au + Burying Blind Hole;

Finished Board Thickness: 1.0mm;

10 layers Board

Process: Immersion Ni/Au + Solder + Burying Blind Hole;

Finished Board Thickness: 1.6mm;

12 layers Board

Process: Immersion Ni/Au + Solder;

Finished Board Thickness: 1.8mm;